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Everything You Need to Know About Flex PCB Assembly

Flex PCB Assembly Guide: Process, Standards & Costs (2026)

Quick Specs Substrate Polyimide (PI), 12.5-125 µm, Tg generally 250-300°C Copper foil Rolled-annealed (RA), ½-1 oz typical Reflow peak Sub-235°C, slow ramp (≤2°C/sec) Governing standards IPC-2223 (design), IPC-6013 (board qualification), J-STD-001 (soldering), IPC-A-610 (assembly acceptance) Inspection stack AOI, X-ray, flying…

The Complete Guide to Flexible PCB Manufacturing (FPC)

Flexible PCB Manufacturer (FPC): The Complete Guide

Opting for a flexible pcb manufacturer is understanding the ins and outs of a fabrication process that’s completely unlike rigid-board fabrication. This one-of-a-kind process bends, requires the copper to be bend-resistant without cracking, and the governing standards are a far…

Rogers PCB and RF Substrate Materials: A Complete Engineering Guide

Rogers PCB Materials: RF Substrate Guide (2026)

Quick Specs Common material families Ceramic-filled hydrocarbon (RO4000), ceramic-filled PTFE (RO3000), pure PTFE (RT/duroid) Dielectric constant (Dk) range 2.2 – 10.2 depending on grade Cost vs. standard FR4 Roughly 3–8× per panel, grade-dependent Governing base-material standard IPC-4103 (vs. IPC-4101 for…

How Ceramic PCB Substrates Actually Work: A Materials-to-Reliability Guide

Ceramic PCB: Materials, DFM & Reliability Guide (2026)

Quick Specs Substrate materials Al₂O₃ (alumina), AlN, Si₃N₄, BeO Thermal conductivity (bulk, room temp) 24–320 W/m·K, material-dependent Operating temperature −55°C to 350°C+ (tier-dependent) Dielectric constant ~6.8–10 (material-dependent) Metallization routes Thick film, thin film, DPC, DBC, AMB, LTCC/HTCC A ceramic PCB…