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Interactive Tool / Via Aspect Ratio
Via Aspect Ratio Checker
Through-hole vias that are too deep for their diameter plate unreliably. Check your board-thickness-to-hole ratio against standard and advanced plating limits.
Aspect ratio = board thickness / finished hole diameter. Standard plating typically handles up to 8:1, advanced lines up to 10:1; higher ratios risk thin or voided plating. Confirm against your fabricator’s capability.
