Through-Hole DFM Checklist Generator

Verify your Gerber + BOM package is complete before submitting for DFM review. Check off each item to see your readiness score.

• ✓
  Gerber files (RS-274X format) — all layers included

  Copper layers, drill file (.drl), board outline, solder mask, silkscreen top and bottom

  Required
• ✓
  BOM includes manufacturer part numbers (not generic)

  Each component has MPN from original manufacturer — not just “100Ω resistor” or “10µF cap”

  Required
• ✓
  BOM specifies RoHS / leaded designation for all THT components

  Each through-hole component marked as RoHS-compliant (SAC305 wave) or leaded (SnPb) as applicable

  Required
• ✓
  DIP package types specified in BOM (8-pin, 16-pin, 40-pin, etc.)

  Dual in-line package pin count and body width (0.3″ or 0.6″) confirmed for all DIP ICs

  Required for DIP
• ✓
  Assembly drawing with component polarity and orientation markings

  Pin 1 indicators, cathode markings, and insertion direction for all non-symmetric THT components

  Required
• ✓
  Through-hole pads sized per IPC-2222 hole-to-lead ratio

  Drill diameter = lead diameter + 0.4mm (optimal per IPC 2222). Oversized holes reduce barrel fill percentage

  IPC-2222
• ✓
  Selective soldering mask zones identified (mixed SMT+THT boards)

  SMT components on the solder side are marked as no-solder zones for selective soldering nozzle programming

  Mixed-technology
• ✓
  Test point access specified (if ICT or functional test required)

  ICT access points documented; flying probe test nodes identified in BOM or assembly notes

  If test required

PCBark’s DFM review covers hole-to-lead ratios, pad geometry, selective solder zones, component clearances, and IPC-A-610 requirements — delivered within 24 hours, no commitment required.