• Gerber + drill files exportedRS-274X Gerbers and an Excellon drill file, or ODB++ / IPC-2581.
• BOM + centroid ready (for assembly)Needed for design-for-assembly checks — placement, polarity, footprint fit.
• Min trace / space ≥ 4 milAt or above standard fab capability; finer needs an advanced line.
• External annular ring ≥ 0.05 mmPads survive drill registration per IPC-2221 / IPC-6012.
• Copper-to-edge clearance setCopper pulled back from the board outline for routing/V-score.
• Solder mask clearance ≥ ~4 milNo mask on pads; mask dams thick enough not to flake.
• Silkscreen clear of padsNo silk over exposed copper; legible line width.
• Via aspect ratio ≤ 8:1Holes platable for the board thickness.

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A self-check, not a substitute for a real DFM analysis — assembly (DFA) and process-specific risk still need a human review against your target fabricator. Send your Gerbers, BOM and centroid and we confirm the rest in 24 hours.