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Ceramic PCB vs. FR-4 Thermal Headroom Estimator
A first-order comparison of how much hotter an FR-4 board runs versus a ceramic substrate for the same heat load. Directional only — PCBark models your real stack-up during DFM.
Through-board temperature rise for the same heat load:
| Material | Conductivity | ΔT rise |
|---|
Ceramic runs cooler through the board than FR-4 here.
Get an engineered TCO & thermal review →Model: ΔT = (Q · L) / (k · A), 1-D conduction through the substrate. Real designs add copper spreading, vias, and heatsinking — this isolates the substrate’s contribution. FR-4 k≈0.4 W/m·K.
