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Aluminum MCPCB RθJA (°C/W)
Aluminum PCB Thermal Resistance Estimator
Estimate junction-to-ambient thermal resistance and how much cooler your component runs on an aluminum MCPCB versus FR-4. First-order model for early board selection.
e.g. a 3 W power LED or MOSFET
Typical thermal-clad dielectric: 0.075–0.15 mm
Copper pad + spread footprint
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Estimated junction temperature (°C) on aluminum MCPCB
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FR-4 RθJA (°C/W)
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Get a DFM thermal review of your board →
First-order estimate: RθJA ≈ dielectric resistance (t / k·A) plus fixed spreading/convection terms. FR-4 baseline uses 0.25 W/m·K laminate. Real performance depends on copper weight, vias, and heatsinking — request a detailed analysis for production designs.
