Answer 5 quick questions about your design and application — we’ll recommend the right assembly technology for your layout and explain why. Takes under 60 seconds.
What is your smallest component package size?
A. Fine pitch — 0201 imperial, BGA, QFN sub-0.5mm pitch
B. Standard SMT — 0402/0603 imperial, SOIC, TQFP, 0.5–0.8mm QFN
C. Mixed — some fine-pitch SMT plus through-hole connectors, transformers, or large caps
D. Through-hole only — connectors, DIP ICs, radial/axial leaded components
Please select an option to continue.
What environment will the PCB operate in?
A. Controlled indoor — office equipment, consumer electronics, standard IoT
B. Light vibration or thermal variation — industrial sensors, HVAC controllers, automotive accessories
C. Harsh — high vibration, wide thermal range, outdoor, military/aerospace prototyping
D. Medical or safety-critical — IPC-A-610 Class 3, full traceability required
Please select an option to continue.
What is your target order quantity?
A. 5–25 boards (prototype / NPI validation)
B. 26–100 boards (small pilot run)
C. 101–500 boards (low-volume production)
D. 500+ boards (consider full production contract)
Please select an option to continue.
Does your design include mechanical or high-current components?
A. No — all ICs, passives, and small connectors (fully SMT compatible)
B. Some — a few board-mount connectors or large electrolytic caps alongside SMT
C. Many — power connectors, large inductors, heat sinks, terminal blocks, relays
D. Primarily mechanical — mostly through-hole for structural or current-handling reasons
Please select an option to continue.
What is your highest priority for this order?
B. Smallest board footprint / highest component density
C. Maximum mechanical reliability under stress
D. Fastest assembly turnaround
Please select an option to continue.
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