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Hidden BGA Defect Cost Estimator
AOI cannot inspect BGA solder joints. Estimate your annual rework exposure when defects reach shipping — and the savings X-ray inspection delivers.
Boards with ≥1 BGA component per month
Average finished board value or BOM cost
Include all BGA-related field failures & returns
Tech hours + materials for BGA rework / reballing
Affects how many hidden defects escape to field
Annual Defect Cost Estimate
Model based on: rework costs 10–20× assembly cost (IPC industry data); X-ray QC reduces defect rates by up to 30% (EMS benchmark); field failure cost estimated at 15× rework cost (includes warranty, logistics, customer NTF returns). Actual costs vary by product and customer contract.
