Via Aspect Ratio Checker

Interactive PCB Tool

Via Aspect Ratio Checker

Aspect ratio = finished board thickness ÷ smallest plated through-hole diameter. It tells you how hard your holes are to drill and reliably plate. Ultra-high-layer 32–42 boards are thick, so they tend to push this ratio high.

Total finished stack-up thickness.
mm
Finished drill diameter of the smallest plated through-hole.
mm

Enter a positive thickness and a positive diameter (both in mm).

Aspect ratio (thickness ÷ diameter)

≤8:1
Standard
8–12:1
Advanced
12–15:1
High-cap
>15:1
Specialist

Why this matters for 32–42 layer boards

Ultra-high-layer 32–42 boards are physically thick, so the same drill diameter yields a much higher aspect ratio. Reliable plating at high ratios typically relies on sequential lamination with laser-drilled microvias and/or back-drilling. Above ~15:1, treat it as a conversation to have with an engineer, not a checkbox.

Request a Quote

Send us your stack-up and drill table for a manufacturability check.