Get in touch with PCBark Company
Interactive Tool / Microvia
Microvia Aspect Ratio Calculator
Check whether a laser microvia will plate reliably before you lock the stack-up. Aspect ratio = dielectric depth ÷ via diameter.
—
Guidance reflects industry-standard HDI practice per IPC-2226 (laser microvias target ≤ 1:1; copper-filled stacked vias are most reliable near 0.8:1). Final limits are confirmed by PCBark engineering in DFM.
