PCBark Ceramic PCB Capability-Tier Matcher | RFQ Readiness
PCBark Ceramic PCB Capability-Tier Matcher
Map your toughest requirement to PCBark’s Standard / Best / Maximum capability tier — so your RFQ lands in the right place and skips a clarification cycle.
Tightest minimum trace / spacing you need
0.10 mm or wider 0.075 mm 0.050 mm
Thermal conductivity required
≤ 30 W/m·K (alumina is fine) ~170–200 W/m·K (AlN class) ≥ 250 W/m·K
Layer count
1–2 layers 3–4 layers 6+ layers / package substrate
Copper thickness
1–3 oz 4–5 oz up to 10 oz
Operating temperature
−40 to +150 °C −55 to +250 °C +350 °C or above
Match my tier →
Include in your RFQ:
Submit my RFQ to PCBark →
Tier is set by your single most demanding parameter. MAXIMUM-tier requirements are evaluated with you case-by-case before commitment.
