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16–24 Layer RFQ & DFM Readiness Checklist
A complete package gets you a real price, a firm lead time, and a DFM review together. Check what you have ready.
Gerber or ODB++ filesThe fabrication data set — required before any firm quote.
Layer stackup with target impedanceNumber of layers, dielectric plan, and single-ended / differential impedance targets.
IPC class (2 or 3)Decided at RFQ — a board cannot be promoted to Class 3 after fabrication.
Base materialHigh Tg FR-4, halogen-free, high-speed, Rogers / Megtron, or hybrid.
Surface finishENIG, ENEPIG, immersion silver, or hard gold.
Quantity (prototype / volume)Tooling dominates at prototype quantity; per-piece cost drops with volume.
Test & coupon requirements100% e-test is standard; flag TDR impedance coupons or reliability testing.
RFQ readiness: 0%
Send what you have — we’ll flag the rest →
Build time rises with layer count and via complexity; PCBark confirms a firm lead time against your stackup at quote and runs quick-turn-to-volume on the same line.
