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PCB DFM Readiness Checker
Run your design through our 12-point DFM checklist before submitting files. Catch production issues before fabrication begins — our free DFM review then confirms the rest within 24 hours.
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Category A — File and BOM Readiness
1Gerber files are in RS-274X, ODB++, or IPC-2581 format
Not .dxf, .pdf, or native EDA project files — these cannot be directly used in production.
2BOM includes Manufacturer Part Numbers (MPNs) for all components
Generic descriptions cause sourcing delays. MPNs needed for procurement from major distributors.
3No missing DNP (Do Not Place) callouts or mismatched component values
BOM-schematic mismatches are caught in DFM review — common cause of production holds.
4Assembly drawings or pick-and-place files (centroid data) are included
Required for automated SMT placement. Without it, manual interpretation slows production.
Category B — PCB Design Parameters
5Minimum trace width ≥ 0.1mm (4 mil) for standard SMT signal traces
Sub-4mil traces increase etching error risk and require premium fabrication.
6Minimum via hole diameter ≥ 0.2mm (8 mil) drill
Smaller vias require laser drilling — higher cost and longer lead time.
7Component-to-component clearance ≥ 0.2mm for SMT parts
Insufficient clearance prevents proper solder paste stencil apertures and creates bridging risk.
8Fiducial marks: ≥ 2 global fiducials on the board panel
Fiducials are required for automated SMT machine vision alignment. Missing fiducials equals manual registration and accuracy risk.
Category C — Soldering and Inspection Considerations
9Solder mask opening expansion ≥ 0.05mm per side from pad edge
Tight solder mask openings can cause solder bridging or lifted pads during reflow.
10Thermal relief connections on through-hole pads connected to large copper planes
Without thermal relief, heat dissipation during soldering is uneven — common cause of cold solder joints on THT connectors.
11BGA/QFN pad pitch ≥ 0.4mm (for standard SMT) — or confirmed fine-pitch capability
Our automated SMT placement handles ≥0201 imperial. Sub-0.4mm BGAs require engineer pre-review.
12No silkscreen text overlapping pads or within solder mask openings
Silkscreen ink on exposed pads contaminates solder joints. Min 0.8mm text height for legibility.
